qmk-firmware/tmk_core/common/test
Donald Kjer e756a21636
eeprom_stm32: implement high density wear leveling (#12567)
* eeprom_stm32: implement wear leveling
Update EECONFIG_MAGIC_NUMBER
eeprom_stm32: check emulated eeprom size is large enough
* eeprom_stm32: Increasing simulated EEPROM density on stm32
* Adding utility script to decode emulated eeprom
* Adding unit tests
* Applying qmk cformat changes
* cleaned up flash mocking
* Fix for stm32eeprom_parser.py checking via signature with wrong base
* Fix for nk65 keyboard

Co-authored-by: Ilya Zhuravlev <whatever@xyz.is>
Co-authored-by: zvecr <git@zvecr.com>
2021-08-23 23:15:34 +01:00
..
_wait.h 2021 May 29 Breaking Changes Update (#13034) 2021-05-29 14:38:50 -07:00
bootloader.c
eeprom_stm32_tests.cpp eeprom_stm32: implement high density wear leveling (#12567) 2021-08-23 23:15:34 +01:00
eeprom.c
flash_stm32_mock.c eeprom_stm32: implement high density wear leveling (#12567) 2021-08-23 23:15:34 +01:00
platform_deps.h Avoid name conflicts with usb_hid Arduino code (#13870) 2021-08-06 15:53:38 +10:00
platform.c Begin to carve out platform/protocol API - Single main loop (#13843) 2021-08-18 00:11:07 +01:00
platform.h Fix unit tests after recent refactor (#13765) 2021-07-29 12:00:39 +10:00
rules.mk eeprom_stm32: implement high density wear leveling (#12567) 2021-08-23 23:15:34 +01:00
suspend.c
testlist.mk eeprom_stm32: implement high density wear leveling (#12567) 2021-08-23 23:15:34 +01:00
timer.c